- 教师: 王晓露
- 已选课学生: 23
With the miniaturization and light-weight trend of electronic products in the electronic information industries, electronic packaging technology has become one of the most important parts in the advanced electronic manufacturing technology. The present methods of manufacturing conventional electronic assemblies have essentially reached their limits as far as cost, weight, volume, and reliability are concerned. Surface mount technology (SMT) makes it possible to produce more reliable assemblies at reduced weight, volume and cost.
This course is intended to meet the needs of newly developed electronic packaging industries with the coverage of, but not limited to, the following areas:
- Introduction of microsystems packaging
- Principles of microjoining and connections
- Electronic Packaging Materials (metals, ceramics, polymers, PCB materials, Components)
- Electronic Packaging Processes (PCB technologies, Pick and Place, Soldering, Inspection)
- Reliability of Electronic Packages
- 教师: 王晓露
- 已选课学生: 23