{"id":505,"date":"2017-08-07T12:02:00","date_gmt":"2017-08-07T12:02:00","guid":{"rendered":"http:\/\/rushmore.wpcolorlab.com\/?page_id=505"},"modified":"2017-08-07T12:02:00","modified_gmt":"2017-08-07T12:02:00","slug":"journal-articles","status":"publish","type":"page","link":"http:\/\/new.guofucourses.cn\/research\/index.php\/journal-articles\/","title":{"rendered":"Journal Articles"},"content":{"rendered":"<p><section class=\"kc-elm kc-css-976837 kc_row\"><div class=\"kc-row-container  kc-container\"><div class=\"kc-wrap-columns\"><div class=\"kc-elm kc-css-496973 kc_col-sm-12 kc_column kc_col-sm-12\"><div class=\"kc-col-container\"><div class=\"kc-elm kc-css-659318 kc_text_block\"><\/p>\n<p><strong>Disclaimer:\u00a0<\/strong>The papers below are intended for private viewing by the page owner or those who otherwise have legitimate access to them. No part of it may in any form or by any electronic, mechanical, photocopying, recording, or any other means be reproduced, stored in a retrieval system or be broadcast or transmitted without the prior permission of the respective publishers. If your organization has a valid subscription of the journals, click on the DOI link for the legitimate copy of the papers.<\/p>\n<p>\n<\/div><\/div><\/div><\/div><\/div><\/section><section class=\"kc-elm kc-css-283790 kc_row\"><div class=\"kc-row-container  kc-container\"><div class=\"kc-wrap-columns\"><div class=\"kc-elm kc-css-704818 kc_col-sm-12 kc_column kc_col-sm-12\"><div class=\"kc-col-container\">\n    <div class=\"rushmore-content-area section-journal-papers kc-elm kc-css-274288\">\n    <nav class=\"journal-papers-nav\">\n        <ul class=\"journal-papers-nav-list list-inline\" role=\"tablist\"><li role=\"presentation\" class=active><a href=\"#2020\" class=\"link-prev_def\" aria-controls=\"2020\" role=\"tab\" data-toggle=\"tab\">2020<\/a><\/li><li role=\"presentation\" ><a href=\"#2019\" class=\"link-prev_def\" aria-controls=\"2019\" role=\"tab\" data-toggle=\"tab\">2019<\/a><\/li><li role=\"presentation\" ><a href=\"#2014\" class=\"link-prev_def\" aria-controls=\"2014\" role=\"tab\" data-toggle=\"tab\">2014<\/a><\/li><li role=\"presentation\" ><a href=\"#2009\" class=\"link-prev_def\" aria-controls=\"2009\" role=\"tab\" data-toggle=\"tab\">2009<\/a><\/li><li role=\"presentation\" ><a href=\"#2007\" class=\"link-prev_def\" aria-controls=\"2007\" role=\"tab\" data-toggle=\"tab\">2007<\/a><\/li><li role=\"presentation\" ><a href=\"#2004\" class=\"link-prev_def\" aria-controls=\"2004\" role=\"tab\" data-toggle=\"tab\">2004<\/a><\/li><\/ul>\n    <\/nav>\n    <div class=\"journal-papers-mound-wrap tab-content\"><div class=\"journal-papers-mound tab-pane fade in active\" id=\"2020\" role=\"tabpanel\"><nav class=\"journal-papers-mound-nav\"><h3 class=\"nav-title\">2020<\/h3><\/nav>\n                <div class=\"journal-papers-list\">\n                    <div class=\"journal-papers\">\n                        <div class=\"row\">\n                            <div class=\"col-sm-3\">\n                                <p class=\"jp-name\">Hao J J, Wang Y S, Wu Y F, Guo F.<\/p>\n                            <\/div>\n                            <div class=\"col-sm-6\">\n                                <div class=\"journal-papers-meta\">\n                                    <p>Metal recovery from waste printed circuit boards: A review for current status and perspectives.<em> Resources, Conservation and Recycling,<\/em> 2020, 157: 104787.<\/p>\n                                <\/div>\n                            <\/div><div class=\"col-sm-3\">\n                                <div class=\"journal-papers-doi\"><span>DOI:<\/span> <a href=\"https:\/\/doi.org\/10.1016\/j.resconrec.2020.104787\" target=\"_blank\">DOI:10.1016\/j.resconrec.2020.104787<\/a><\/div>\n                            <\/div><\/div>\n                    <\/div><!-- \/.journal-papers -->\n                <\/div><\/div><div class=\"journal-papers-mound tab-pane fade \" id=\"2019\" role=\"tabpanel\"><nav class=\"journal-papers-mound-nav\"><h3 class=\"nav-title\">2019<\/h3><\/nav>\n                <div class=\"journal-papers-list\">\n                    <div class=\"journal-papers\">\n                        <div class=\"row\">\n                            <div class=\"col-sm-3\">\n                                <p class=\"jp-name\">Han J, Guo F.<\/p>\n                            <\/div>\n                            <div class=\"col-sm-6\">\n                                <div class=\"journal-papers-meta\">\n                                    <p>Double tricrystal nucleation behavior in Pb-free BGA solder joints.<em> Microelectronics Reliability,<\/em> 2019, 98:1-9<\/p>\n                                <\/div>\n                            <\/div><div class=\"col-sm-3\">\n                                <div class=\"journal-papers-doi\"><span>DOI:<\/span> <a href=\"#\" target=\"_self\">DOI:10.1016\/j.microrel.2019.04.021<\/a><\/div>\n                            <\/div><\/div>\n                    <\/div><!-- \/.journal-papers -->\n                <\/div><\/div><div class=\"journal-papers-mound tab-pane fade \" id=\"2014\" role=\"tabpanel\"><nav class=\"journal-papers-mound-nav\"><h3 class=\"nav-title\">2014<\/h3><\/nav>\n                <div class=\"journal-papers-list\">\n                    <div class=\"journal-papers\">\n                        <div class=\"row\">\n                            <div class=\"col-sm-3\">\n                                <p class=\"jp-name\">Y. T. Shu, R. Zhao, F. Guo, et al.  <\/p>\n                            <\/div>\n                            <div class=\"col-sm-6\">\n                                <div class=\"journal-papers-meta\">\n                                    <p>Improvement of thermoelectric properties via combination of nanostructurization and elemental doping.<em> JOM,<\/em> 2014, 66(11): 2298-2308.<\/p>\n                                <\/div>\n                            <\/div><div class=\"col-sm-3\">\n                                <div class=\"journal-papers-doi\"><span>DOI:<\/span> <a href=\"https:\/\/doi.org\/10.1007\/s11837-014-1148-z\" target=\"_blank\">DOI:10.1007\/s11837-014-1148-z<\/a><\/div>\n                            <\/div><\/div>\n                    <\/div><!-- \/.journal-papers -->\n                <\/div><\/div><div class=\"journal-papers-mound tab-pane fade \" id=\"2009\" role=\"tabpanel\"><nav class=\"journal-papers-mound-nav\"><h3 class=\"nav-title\">2009<\/h3><\/nav>\n                <div class=\"journal-papers-list\">\n                    <div class=\"journal-papers\">\n                        <div class=\"row\">\n                            <div class=\"col-sm-3\">\n                                <p class=\"jp-name\">F. Guo, M. Zhao, Z. Xia, Y. Lei, X. Li, and Y. Shi<\/p>\n                            <\/div>\n                            <div class=\"col-sm-6\">\n                                <div class=\"journal-papers-meta\">\n                                    <p>Lead-free solders with rare earth additions<em> , JOM<\/em> 61(6), 39(2009)<\/p>\n                                <\/div>\n                            <\/div><div class=\"col-sm-3\">\n                                <div class=\"journal-papers-doi\"><span>DOI:<\/span> <a href=\"https:\/\/doi.org\/10.1007\/s11837-009-0086-7\" target=\"_blank\">https:\/\/doi.org\/10.1007\/s11837-009-0086-7<\/a><\/div>\n                            <\/div><\/div>\n                    <\/div><!-- \/.journal-papers -->\n                <\/div><\/div><div class=\"journal-papers-mound tab-pane fade \" id=\"2007\" role=\"tabpanel\"><nav class=\"journal-papers-mound-nav\"><h3 class=\"nav-title\">2007<\/h3><\/nav>\n                <div class=\"journal-papers-list\">\n                    <div class=\"journal-papers\">\n                        <div class=\"row\">\n                            <div class=\"col-sm-3\">\n                                <p class=\"jp-name\">F. Guo<\/p>\n                            <\/div>\n                            <div class=\"col-sm-6\">\n                                <div class=\"journal-papers-meta\">\n                                    <p>Composite lead-free electronic solders<em> , J Mater Sci: Mater Electron,<\/em> volume 18, Numbers 1-3, ISSN 0957-4522 March 2007, pp.129<\/p>\n                                <\/div>\n                            <\/div><div class=\"col-sm-3\">\n                                <div class=\"journal-papers-doi\"><span>DOI:<\/span> <a href=\"https:\/\/doi.org\/10.1007\/978-0-387-48433-4_8\" target=\"_blank\">DOI: 10.1007\/978-0-387-48433-4_8<\/a><\/div>\n                            <\/div><\/div>\n                    <\/div><!-- \/.journal-papers -->\n                <\/div><\/div><div class=\"journal-papers-mound tab-pane fade \" id=\"2004\" role=\"tabpanel\"><nav class=\"journal-papers-mound-nav\"><h3 class=\"nav-title\">2004<\/h3><\/nav>\n                <div class=\"journal-papers-list\">\n                    <div class=\"journal-papers\">\n                        <div class=\"row\">\n                            <div class=\"col-sm-3\">\n                                <p class=\"jp-name\">K.F. Hsu, S. Loo, F. Guo, et al.<\/p>\n                            <\/div>\n                            <div class=\"col-sm-6\">\n                                <div class=\"journal-papers-meta\">\n                                    <p>Cubic AgPbmSbTe2+m: Bulk Thermoelectric Materials with High Figure of Merit<em> , Science,<\/em> 2004, 303:818.<\/p>\n                                <\/div>\n                            <\/div><div class=\"col-sm-3\">\n                                <div class=\"journal-papers-doi\"><span>DOI:<\/span> <a href=\"#\" target=\"_self\">DOI: 10.1126\/science.1092963<\/a><\/div>\n                            <\/div><\/div>\n                    <\/div><!-- \/.journal-papers -->\n                <\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/section><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":250,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"_links":{"self":[{"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/pages\/505"}],"collection":[{"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/comments?post=505"}],"version-history":[{"count":0,"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/pages\/505\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/media\/250"}],"wp:attachment":[{"href":"http:\/\/new.guofucourses.cn\/research\/index.php\/wp-json\/wp\/v2\/media?parent=505"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}