{"id":275,"date":"2017-08-02T11:37:36","date_gmt":"2017-08-02T03:37:36","guid":{"rendered":"http:\/\/rushmore.wpcolorlab.com\/?page_id=275"},"modified":"2021-08-12T15:47:20","modified_gmt":"2021-08-12T07:47:20","slug":"lab","status":"publish","type":"page","link":"http:\/\/new.guofucourses.cn\/research\/index.php\/lab\/","title":{"rendered":"Research"},"content":{"rendered":"

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Research is seeing what everybody else has seen and thinking what nobody else has thought.<\/h2>\n<\/div>\n<\/div><\/div>
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Analyzing the detrimental effects of the mass transport under high current density. Understanding how thermoelectric power factors balance the best. Exploring new noble metal leaching solutions from waste printed circuit boards. Pushing the boundaries of solder joint life span. Producing new and inspiring interconnects for smart vehicle electronics. These are just a small sampling of the different types of research and creative activities taking place at our lab on a daily basis.<\/p>\n

Research and creative activity is about discovery. It\u2019s about having an idea and finding the right environment in which to explore that idea. At our Lab of Electronic Packaging Research, we take great pride in our ability to provide supportive environments for the exploration of all types of ideas. Our collaborative and interdisciplinary efforts by student and faculty researchers aim to gain new knowledge and pursue new discoveries in improving society and helping drive human advancement.<\/p>\n

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Research Areas<\/h2>\n<\/div>\n<\/div><\/div><\/div><\/div><\/section>
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Microelectronic Packaging Interconnect Materials and Reliability<\/h2>

Composite and alloying appoaches were applied to modify the service capability of<\/p>\nread more<\/a><\/div>\n <\/article><\/div><\/div>

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Novel Materials and Printing Technology for Flexible Electronics<\/h2>

Flexible electronics featured by bendability and\/or stretchability enable unconventional <\/p>\nread more<\/a><\/div>\n <\/article><\/div><\/div>

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Advanced Thermoelectric Materials with High Figure of Merit<\/h2>

Thermoelectric materials, which capable of directly convert waste heat of electricity were<\/p>\nread more<\/a><\/div>\n <\/article><\/div><\/div>

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Recycling, Recover, and Reuse of Waste Electronic Products<\/h2>

Printed circuit boards (PCBs) represent one of the most complicated and valuable<\/p>\nread more<\/a><\/div>\n <\/article><\/div><\/div><\/div><\/div><\/section>

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Research Facilities<\/h2>\n<\/div>\n
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Mechanical Testing<\/h3>

Tensile testing with different strain rate and temperature, creep testing, thermal fatigue chamber, etc.<\/p>\n\n <\/div><\/div><\/div>

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Thermal Analysis<\/h3>

We are providing all thermal analysis related testings, like DSC, TGA, TMA, DMA, including the solder wetting force tester.<\/p>\n\n <\/div><\/div><\/div>

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Microstructural Characterization<\/h3>

The Microscopic Analysis Center offers up-to-date characterization facilities including XRD, SEM, HRTEM, etc.<\/p>\n\n <\/div><\/div><\/div>

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SMT Assembly Line<\/h3>

A complete SMT line including the pick and place machine, reflow oven, inspection, cleaning facilities are setup in the lab. <\/p>\n\n <\/div><\/div><\/div><\/div><\/div><\/section>

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Why Student Research?<\/h2>\n<\/div>\n<\/div><\/div><\/div><\/div><\/section>
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